| 摘要 |
The present invention is to provide a two-layered flexible substrate using a metallization method which is superior in manufacturing fine wires and a printed circuit board using the two-layered flexible substrate as a base material in manufacture using a semi-additive method. The two-layered flexible substrate of the present invention includes: a lower metal layer which comprises an alloy having nickel without disposing an adhesive on at least one side of an insulation film; a copper thin film layer which is formed on the lower metal layer through a dry plating method; and a copper plated cover layer which is formed on the surface of the copper thin film layer through an electroplating method. The sulfur content, included in the copper plating cover layer which ranges as deep as 0.4 μm from the surface of the copper plating cover toward the insulation film, is 10-150 wt ppm. |
