发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To increase the capacity of a capacitative element, and to suppress variations in the capacity of the capacitative element.SOLUTION: A trench TNH is formed in a multilayered insulating layer MTL. A capacitative element CND is embedded in the trench TNH. A second insulating film INSL2 is an SiCOH film. The trench TNH has a structure in which a first opening OP1 and a second opening OP2 are repeatedly superposed. The first opening OP1 is formed in a first etching stopper film ETS1. The second opening OP2 is formed in a second insulating film INSL2. The second opening OP2 is larger than the first opening OP1 in a plan view, and includes the first opening OP1 in its inside.
申请公布号 JP2014075504(A) 申请公布日期 2014.04.24
申请号 JP20120222732 申请日期 2012.10.05
申请人 RENESAS ELECTRONICS CORP 发明人 USAMI TATSUYA
分类号 H01L21/8242;H01L27/10;H01L27/108 主分类号 H01L21/8242
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