发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a resin composition not generating eruptions after extrusion coating molding and excellent in physical properties such as tension property, when used as an insulation material of wires for example.SOLUTION: The above problem is solved by a resin composition produced by blending (a) 100 pts.mass of polyethylene, (b) 0.5 to 5.0 pts.mass of a silane coupling agent, (c) 0.01 to 0.5 pt.mass of an organic peroxide, and (d) 0.05 to 0.5 pt.mass of a bismuth compound-based silanol condensation catalyst.
申请公布号 JP2014074093(A) 申请公布日期 2014.04.24
申请号 JP20120220903 申请日期 2012.10.03
申请人 RIKEN TECHNOS CORP 发明人 SAITO SHINICHI;MITSUYANAGI KEIKO
分类号 C08L23/04;C08F8/00;C08F255/02;C08K5/14;C08K5/54;C08K5/56;H01B3/44;H01B7/02;H01B13/14 主分类号 C08L23/04
代理机构 代理人
主权项
地址