| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin application device and a resin application method capable of increasing the production yield and the productivity by controlling the light emission characteristics of LED packages to be uniform even when the emission wavelength from each piece of LED elements varies in an LED package manufacturing system.SOLUTION: In a resin application used in manufacturing an LED package, in which LED elements are covered with a resin including a fluorescent substance, the resin application is performed by selecting, during performing a test application for light emission characteristic measurement, either a second mode in which a resin 8 is applied for actual production in parallel; and a first mode in which the application of the resin 8 for actual production is not basically performed. With this, the LED package can be manufactured in accordance with the actual production situation. |
