| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing system and a manufacturing method of an LED package capable of variously adjusting luminescent color and superior in productivity.SOLUTION: The LED package manufacturing system includes: a component mounting device for mounting an LED element on a board; and a resin application device. The resin application device has a resin application section and an application control section for controlling the same. The resin application section is provided with a first nozzle for discharging a first resin and a second nozzle for discharging a second resin. The application control section performs a first control in which a curable first resin is discharged from the first nozzle to apply the first resin on the LED element mounted on the board and a second control in which, after performing the first control, before the applied first resin is cured, a curable second resin is discharged from the second nozzle to apply the second resin over the applied first resin on a resin application area. Either one of the first resin and the second resin includes a first fluorescent substance. |
