发明名称 PACKAGING FOR SEMICONDUCTOR SENSOR DEVICES AND METHODS
摘要 A pressure sensor includes a first housing having a cavity. The pressure sensor further includes a pressure sensing device attached to a bottom of the cavity. The pressure sensor further includes a layer of gel over the pressure sensing device. The pressure sensor further includes a baffle in contact with the gel to reduce movement of the gel.
申请公布号 US2014110801(A1) 申请公布日期 2014.04.24
申请号 US201213657250 申请日期 2012.10.22
申请人 HIGGINS, III LEO M. 发明人 HIGGINS, III LEO M.
分类号 H01L29/84;H01L21/02 主分类号 H01L29/84
代理机构 代理人
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