发明名称 |
Apparatus and Method for Lithography Patterning |
摘要 |
An apparatus and method for lithography patterning is disclosed. An exemplary method includes receiving a first mask. The method further includes receiving a defect map, the defect map identifying a defect region of a defect of the first mask. The method further includes preparing processing data, the processing data including pattern data of a semiconductor device and data associated with the defect region. The method further includes processing the first mask according to the processing data thereby forming a first portion of a pattern of the semiconductor device on the first mask, the first portion of the pattern excluding the defect region. |
申请公布号 |
US2014113220(A1) |
申请公布日期 |
2014.04.24 |
申请号 |
US201213658478 |
申请日期 |
2012.10.23 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
发明人 |
CHU YUAN-CHIH |
分类号 |
G03F7/20;G03B27/58;G03F1/22 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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