METHOD OF PREPARING CONDUCTING LAYER OF METAL PLATE

摘要

Disclosed is a method of forming a conductive layer of a metal substrate using a metal heat dissipation substrate with high heat dissipation. The present invention comprises a step of forming an anodizing film as an insulation layer on at least one surface of one metal heat dissipation board selected from aluminum, aluminum alloys, magnesium, and magnesium alloys by adopting an anodic oxidation method; a step of forming a paste metal layer on the anodizing film with a printing method and solidifying the paste metal layer by heat treatment; a step of forming a cross-section in a thin semi-elliptical shape by using a chemical etching method using a paste washing solution for the irregular cross-section of the solidified paste metal layer; and a step of performing drying after the chemical etching process.