发明名称 CONTROL SYSTEM FOR CURVED PLATE ROUNDING PROCESSING APPARATUS AND CONTROL METHOD THEREOF
摘要 <p>Disclosed are a control system for a surface machining apparatus, which is capable of forming an embossed protrusion with a regular design pattern on the surface of a curved molding, and a control method for the same. The control system for a curved surface machining apparatus comprises: a measuring device having a first measuring part measuring a shape of the curved molding having an embossed protrusion and a second measuring part measuring a tool comprised in a cutting drive part cutting the molding; and a controlling device collecting and analyzing data measured with the measuring device to control the measuring device and the cutting drive part.</p>
申请公布号 KR20140048677(A) 申请公布日期 2014.04.24
申请号 KR20120114920 申请日期 2012.10.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BYUN, JUNG WON;LEE, HYEON MIN;HONG, SEOK MOO
分类号 B23Q15/00;B23Q17/20;B23Q17/22;G05B19/18 主分类号 B23Q15/00
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