发明名称 |
CONTROL SYSTEM FOR CURVED PLATE ROUNDING PROCESSING APPARATUS AND CONTROL METHOD THEREOF |
摘要 |
<p>Disclosed are a control system for a surface machining apparatus, which is capable of forming an embossed protrusion with a regular design pattern on the surface of a curved molding, and a control method for the same. The control system for a curved surface machining apparatus comprises: a measuring device having a first measuring part measuring a shape of the curved molding having an embossed protrusion and a second measuring part measuring a tool comprised in a cutting drive part cutting the molding; and a controlling device collecting and analyzing data measured with the measuring device to control the measuring device and the cutting drive part.</p> |
申请公布号 |
KR20140048677(A) |
申请公布日期 |
2014.04.24 |
申请号 |
KR20120114920 |
申请日期 |
2012.10.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BYUN, JUNG WON;LEE, HYEON MIN;HONG, SEOK MOO |
分类号 |
B23Q15/00;B23Q17/20;B23Q17/22;G05B19/18 |
主分类号 |
B23Q15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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