| 摘要 |
<p>A substrate processing apparatus processes end sections (61a, 61b) of a film surface (61) of a substrate to be processed (60) having a substrate (62) and the film surface (61) provided on the substrate (62). The substrate processing apparatus is provided with: a sucking/holding section (10) which sucks and holds the substrate to be processed (60) from above in a state where the substrate (62) is positioned above the film surface (61); a laser irradiation apparatus (20) which radiates a laser beam (L); and a laser moving section (22) which moves the laser irradiation apparatus (20) in the horizontal direction. The end sections (61a, 61b) of the film surface (61) of the substrate to be processed (60), which is held by means of the sucking/holding section (10), are processed by moving the laser irradiation apparatus (20), while radiating the laser beam (L) from the laser irradiation apparatus (20).</p> |
