| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which prevents the generation of an outgas on curing reaction and on solder reflow treatment, when an electric element is joined or sealed to a substrate with an epoxy resin composition, and is sufficiently cured. SOLUTION: The epoxy resin composition is characterized by comprising an epoxy compound (A), a curing agent (B), and a curing catalyst (C); the epoxy compound (A) comprises 30 to 55 mass% of a glycidyl type epoxy compound (a1), 35 to 60 mass% of an alicyclic epoxy compound (a2) and 5 to 30 mass% of a urethane-modified epoxy compound (a3); the curing agent (B) is an aluminum chelate-based latent curing agent in which an aluminum chelate-based curing agent is held with a porous resin obtained by the interfacial polymerization of a multi-functional isocyanate compound; the curing catalyst (C) is a silanol compound having a specific structure; the aluminum chelate-based latent curing agent (B) is compounded in an amount of 0.5 to 5 pts.mass per 100 pts.mass of the epoxy compound (A). COPYRIGHT: (C)2011,JPO&INPIT |
