METHOD FOR ENHANCING ADHESION OF LOW PROFILE SUBSTRATE

摘要

The present invention relates to a method to enhance adhesion of a surface of a low profile substrate comprising a step of hydrophilic treating a substrate surface; and a step of chemical copper plating the hydrophilic treated substrate. According to an embodiment of the present invention, in order to implement a fine circuit pattern on the low profile substrate, blister generation is suppressed through surface hydrophilic treatment using air pressure plasma and a chemical copper plating process so that formation of a fine circuit pattern is possible and the adhesion effect with the formed fine circuit pattern is improved. [Reference numerals] (AA) Surface hydrophilic treatment step; (BB) Organic matter removing step on a base surface; (CC) Surface activation step; (DD) Catalyst adsorption step; (EE) Catalyzed step; (FF) Chemical copper plating step; (GG) Dry film (DF) processing step; (HH) Pattern forming step