发明名称 |
SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A SEMICONDUCTOR WAFER |
摘要 |
A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer. <IMAGE> |
申请公布号 |
EP1113093(B1) |
申请公布日期 |
2014.04.23 |
申请号 |
EP19990919638 |
申请日期 |
1999.05.18 |
申请人 |
EBARA CORPORATION |
发明人 |
YOSHIOKA, JUNICHIRO;MUKAIYAMA, YOSHITAKA |
分类号 |
C25D17/06;H01L21/687 |
主分类号 |
C25D17/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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