发明名称 SEMICONDUCTOR WAFER HOLDER AND ELECTROPLATING SYSTEM FOR PLATING A SEMICONDUCTOR WAFER
摘要 A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer. <IMAGE>
申请公布号 EP1113093(B1) 申请公布日期 2014.04.23
申请号 EP19990919638 申请日期 1999.05.18
申请人 EBARA CORPORATION 发明人 YOSHIOKA, JUNICHIRO;MUKAIYAMA, YOSHITAKA
分类号 C25D17/06;H01L21/687 主分类号 C25D17/06
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