| 摘要 |
Disclosed are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a first conductive semiconductor layer on the substrate, an active layer on the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, a first via electrode to make contact with the first conductive semiconductor layer through a via hole formed through the substrate, and a second via electrode to make contact with the second conductive semiconductor layer through a second via hole formed through the substrate, the first conductive semiconductor layer, and the active layer. |
