发明名称 NOVEL CONDUCTIVE LAYER INTEGRATED FPC
摘要 <p>A conductive-layer-integrated flexible printed circuit includes: (A) an electromagnetic-shielding conductive layer; (B) a photosensitive resin composition layer; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the photosensitive resin composition layer, and (C) the a wiring-pattern-equipped film being laminated in this order, and (B) the photosensitive resin composition layer being formed from a photosensitive resin composition containing at least (a) carboxyl-group-containing resin, (b) a photo-polymerization initiator, and (c) thermosetting resin.</p>
申请公布号 KR20140048205(A) 申请公布日期 2014.04.23
申请号 KR20147001222 申请日期 2012.07.10
申请人 KANEKA CORPORATION 发明人 KIDO MASAYOSHI;SEKITO YOSHIHIDE
分类号 H05K9/00;H05K1/02;H05K3/28 主分类号 H05K9/00
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