| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting solder resist composition which satisfies chemical resistance, thermal resistance, hardness, electrical insulation, adhesion and print performance required for a solder resist layer for a printed wiring board, and is also excellent in high color retention, and to provide a solder resist layer composed of a cured product of the thermosetting solder resist composition and the printed wiring board. SOLUTION: A thermosetting solder resist composition comprises: a white thermosetting solder resist composition which has crosslink density after curing of more than 12,000 mol/m<SP POS="POST">3</SP>and glass transition temperature higher than 150°C; and a white solder resist layer composed of a cured product of the white thermosetting solder resist composition. COPYRIGHT: (C)2013,JPO&INPIT |
