| 摘要 |
The present invention relates to apparatus and method for electrical testing for flip chip. An embodiment of the present invention provides a pad (100) on a flip chip, comprising: a first portion (101) for contact with one or more tips of a probe device during a testing before a bumping on the pad; and a second portion (102) for the bumping without contact with the one or more tips during the testing. The flip chip and manufacturing methods are also disclosed. With embodiments of the present invention, the pads on a flip chips may be tested using a probe card while estimating the problems caused by the probe marks on the pads. |
