| 摘要 |
A solder ball mounting apparatus according to the present invention includes a table which mounts a printed circuit board on the upper side thereof, a mounting mask which includes each opening part corresponding to each pad of the printed circuit board and is mounted on the table to be overlapped by interposing the printed circuit board, and at least one squeeze which is formed on one side of the upper side of the mounting mask and squeezes a plurality of solder balls in one direction. [Reference numerals] (400) Control part; (500) Display part |
