发明名称 EPOXY RESIN COMPOSITION FOR INSULATION, INSULATING FILM, PREPREG, AND PRINTED CIRCUIT BOARD
摘要 The invention relates to an insulation epoxy resin composition, an insulation film, a prepreg and a green sheet. According to the invention, the epoxy resin composition containing LiCl/DMAc cellulose water solution or LiCl/DMF cellulose water solution, soluble liquid crystal oligomer, epoxy resin and inorganic filler, and the insulation film, the prepreg and the green sheet prepared by using the composition. The insulation epoxy resin composition, the insulation film, the prepreg and the green sheet are low in thermal expansion indexes, high in glass transition temperature and high in tenacity.
申请公布号 KR101388820(B1) 申请公布日期 2014.04.23
申请号 KR20120104040 申请日期 2012.09.19
申请人 发明人
分类号 C08J5/24;C08L1/02;C08L63/00;H01B3/40 主分类号 C08J5/24
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