发明名称
摘要 PURPOSE: A laser processing device is provided to enable a part near a processed part to be rapidly heated to over a given temperature since hot for heating the part near the processed part is supplied. CONSTITUTION: A laser processing device(101) comprises a blowing unit, a supply unit, an irradiating unit and a control unit(152). The blowing unit supplies hot air for heating a part near a processed part. The supply unit supplies or discharges raw gas and thus maintains the part near the processed part under atmosphere of the raw gas. The irradiating unit irradiates laser beam to the processed part. The control unit controls the blowing unit, the supply unit and the irradiating unit.
申请公布号 JP5476519(B2) 申请公布日期 2014.04.23
申请号 JP20100010481 申请日期 2010.01.20
申请人 发明人
分类号 C23C16/48 主分类号 C23C16/48
代理机构 代理人
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