发明名称 Heat insulation layer
摘要 <p>The thermal insulation layer (1) has recyclable insulating boards arranged side by side, where the thermal insulation layer is arranged between a building-ground (6) and a base plate (4) and is formed by the insulating boards. The insulating boards are provided along plate sides that are attached corresponding to each other, and the interlocking devices include the plate sides. The interlocking devices are formed as a groove-clip-dovetail connection and include grooves and clips on the plate sides. The insulating board is formed by heat insulating material i.e. light-weight concrete.</p>
申请公布号 EP2312061(B1) 申请公布日期 2014.04.23
申请号 EP20090013097 申请日期 2009.10.16
申请人 PENZ-FREIHEIT, RAMONA;FEHR, PETER 发明人 FREIHEIT, MICHAEL;FEHR, PETER
分类号 E02D27/01;E02D31/00 主分类号 E02D27/01
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