发明名称 WIRING SUBSTRATE
摘要 <p>A wiring board includes an electronic part (50) and a core board (21). A through-hole (22) is extended through the core board and accommodates the electronic part which has a body (51) and connection terminals (52). The body includes first sides (51A), second sides (51B) and third sides (51C, 51D) which face with each other. The connection terminals cover the first side. First protrusions (23) protrude from walls of the through-hole toward the first sides. The first protrusion of each includes an end unit which comes in contact with one among the connection terminals. Second protrusions protrude from walls of the through-hole toward the second sides. The facing second protrusions include end units which are separated apart with a distance (L1) which is longer than a distance (L2) between the second sides and is shorter than a distance (L3) between the two farthest points around the first sides.</p>
申请公布号 KR20140048042(A) 申请公布日期 2014.04.23
申请号 KR20130118347 申请日期 2013.10.04
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 MACHIDA TAKEMI;TAKIZAWA DAISUKE
分类号 H05K3/46 主分类号 H05K3/46
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