| 摘要 |
According to the present invention, provided is a substrate with built-in electronic components, which comprises: a first insulating substrate which has one or more first conductive patterns; a core unit which is formed on one side of the first insulating substrate; one or more first electronic components which are placed in the core unit and have a ring-shaped coil electrically connected to the first conductive pattern; and a dummy pad which is formed inside the coil by being separated from the coil and includes copper (Cu). |
