发明名称 External storage device and method of manufacturing external storage device
摘要 A storage element is provided in a semiconductor chip, and an inductor and a driver circuit are provided in another semiconductor chip. An external terminal is a contact type terminal, and at least some external terminals are a power supply terminal and a ground terminal. A sealing resin layer is formed over a first surface of an interconnect substrate and seals the semiconductor chips but does not cover the external terminal. The inductor is formed at a surface of the semiconductor chip not facing the interconnect substrate.
申请公布号 US8705238(B2) 申请公布日期 2014.04.22
申请号 US20100926710 申请日期 2010.12.06
申请人 NAKASHIBA YASUTAKA;OGAWA KENTA;RENESAS ELECTRONICS CORPORATION 发明人 NAKASHIBA YASUTAKA;OGAWA KENTA
分类号 H05K7/20;H01F7/06;H01L23/48 主分类号 H05K7/20
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