发明名称 |
External storage device and method of manufacturing external storage device |
摘要 |
A storage element is provided in a semiconductor chip, and an inductor and a driver circuit are provided in another semiconductor chip. An external terminal is a contact type terminal, and at least some external terminals are a power supply terminal and a ground terminal. A sealing resin layer is formed over a first surface of an interconnect substrate and seals the semiconductor chips but does not cover the external terminal. The inductor is formed at a surface of the semiconductor chip not facing the interconnect substrate. |
申请公布号 |
US8705238(B2) |
申请公布日期 |
2014.04.22 |
申请号 |
US20100926710 |
申请日期 |
2010.12.06 |
申请人 |
NAKASHIBA YASUTAKA;OGAWA KENTA;RENESAS ELECTRONICS CORPORATION |
发明人 |
NAKASHIBA YASUTAKA;OGAWA KENTA |
分类号 |
H05K7/20;H01F7/06;H01L23/48 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|