发明名称 |
Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a warpage-compensation zone with a substrate-interior layer exposed from a top substrate-cover, and the warpage-compensation zone having contiguous exposed portion of the substrate-interior layer over corner portions of the package substrate; connecting an integrated circuit die to the package substrate with an internal interconnect; and forming an encapsulation over the integrated circuit die, with the encapsulation directly on the substrate-interior layer in the warpage-compensation zone. |
申请公布号 |
US8703535(B2) |
申请公布日期 |
2014.04.22 |
申请号 |
US201213490908 |
申请日期 |
2012.06.07 |
申请人 |
KIM MINJUNG;CHOI DAESIK;YU MINWOOK;PARK YISU;STATS CHIPPAC LTD. |
发明人 |
KIM MINJUNG;CHOI DAESIK;YU MINWOOK;PARK YISU |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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