METHOD FOR MANUFACTURING PRECISION PCB FORMING CIRCUIT PATTERN AND CONNECTING THE CIRCUIT PATTERN THROUGH VIA-HOLE

摘要

The present invention relates to a method for forming a precise PCB, capable of forming a conductive line in a through hole and a circuit pattern. The method for forming the precise PCB includes the steps of forming a first circuit pattern with conductivity comprising a circuit on the upper side of an insulation layer; forming a second circuit pattern with conductivity comprising a circuit on the lower side of the insulation layer; forming a through hole which vertically passes through the insulation layer; and forming a conductive material on the inner circumference of the through hole to electrically connect the first and second circuit patterns by the through hole. [Reference numerals] (AA) First circuit pattern printing process; (BB) Second circuit pattern printing process; (CC) Protective film laminating process; (DD) Through hole processing process; (EE) Through hole printing process; (FF) Protective film delaminating and heat treatment process