发明名称 Method for manufacturing semiconductor device
摘要 In a transistor including an oxide semiconductor film, a metal oxide film which has a function of preventing electrification and covers a source electrode and a drain electrode is formed in contact with the oxide semiconductor film, and then, heat treatment is performed. Through the heat treatment, impurities such as hydrogen, moisture, a hydroxyl group, or hydride are intentionally removed from the oxide semiconductor film, whereby the oxide semiconductor film is highly purified. By providing the metal oxide film, generation of a parasitic channel on the back channel side of the oxide semiconductor film in the transistor can be prevented.
申请公布号 US8704219(B2) 申请公布日期 2014.04.22
申请号 US201113071845 申请日期 2011.03.25
申请人 YAMAZAKI SHUNPEI;GODO HIROMICHI;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;GODO HIROMICHI
分类号 H01L29/12;H01L29/786 主分类号 H01L29/12
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