| 摘要 |
<p>The present invention relates to an apparatus and a method for manufacturing a semiconductor substrate and, more specifically, to an apparatus and a method for drying a substrate. According to an embodiment of the present invention, the apparatus for drying a substrate comprises: a housing which provides a space for performing a drying process; a substrate support member which is placed inside the housing and supports a substrate; a fluid supply member which includes a supply line supplying a process fluid in a supercritical state to the housing; and an exhaust member which includes an exhaust line discharging the process fluid from the housing, wherein the supply line includes a first supply line which supplies the process fluid to the housing at a first supply flow rate, and a second supply line which supplies the process fluid to the housing at a second supply flow rate. The supply line further includes a front supply line connected to a storage unit for the process fluid and a back supply line connected to the housing, wherein the first supply line and the second supply line are connected in parallel, and the front supply line and the back supply line can be connected.</p> |
