发明名称 |
Heat dissipating substrate and method of manufacturing the same |
摘要 |
Disclosed herein is a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin. |
申请公布号 |
US8704100(B2) |
申请公布日期 |
2014.04.22 |
申请号 |
US20100717855 |
申请日期 |
2010.03.04 |
申请人 |
LEE SANG YOUP;RYU JOUNG GUL;KIM DONG SUN;CHOI JAE HOON;SEO IN HO;SAMSUNG ELECTRO-MECHANICS CO., LTD |
发明人 |
LEE SANG YOUP;RYU JOUNG GUL;KIM DONG SUN;CHOI JAE HOON;SEO IN HO |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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