发明名称 Polishing pad sub plate
摘要 A construction of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered.
申请公布号 US8702477(B2) 申请公布日期 2014.04.22
申请号 US201113020686 申请日期 2011.02.03
申请人 SUZUKI TATSUTOSHI;SUZUKI EISUKE;TOHO ENGINEERING 发明人 SUZUKI TATSUTOSHI;SUZUKI EISUKE
分类号 B24B5/00;B24B37/04;B24B37/30;H01L21/304 主分类号 B24B5/00
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