发明名称 |
Light emitting devices having current reducing structures |
摘要 |
A light emitting device includes a p-type semiconductor layer, an n-type semiconductor layer and an active region between the p-type semiconductor layer and the n-type semiconductor layer. A bond pad is provided on one of the p-type semiconductor layer or the n-type semiconductor layer, opposite the active region, the bond pad being electrically connected to the one of the p-type semiconductor layer or the n-type semiconductor layer. A conductive finger extends from and is electrically connected to the bond pad. A reduced conductivity region is provided in the light emitting device that is aligned with the conductive finger. A reflector may also be provided between the bond pad and the reduced conductivity region. A reduced conductivity region may also be provided in the light emitting device that is not aligned with the bond pad. |
申请公布号 |
US8704240(B2) |
申请公布日期 |
2014.04.22 |
申请号 |
US201313856928 |
申请日期 |
2013.04.04 |
申请人 |
CREE, INC. |
发明人 |
EMERSON DAVID TODD;HABERERN KEVIN;BERGMANN MICHAEL JOHN;SLATER, JR. DAVID B.;DONOFRIO MATTHEW;EDMOND JOHN |
分类号 |
H01L33/00;H01L33/14;H01L33/38 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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