| 摘要 |
A method of manufacturing a semiconductor composite device, including steps of: preparing a substrate comprising circuit elements, which are part of a driving circuit; attaching an array of driven elements onto the substrate via a passivation layer, the array being formed of a semiconductor thin film having a crystal structure wherein the driven elements are arrayed to be driven by the driving circuit; and forming a metal wire by a photo-lithography method such that the circuit elements are electrically connected with the metal wire to form the driving circuit and the driving circuit is electrically connected to the driven elements with the metal wire. |
