发明名称 |
Package on package structures and methods for forming the same |
摘要 |
The described embodiments of forming bonding structures for package on package involves removing a portion of connectors and molding compound of the lower package. The described bonding mechanisms enable easier placement and alignment of connectors of an upper package to with connector of a lower package. As a result, the process window of the bonding process is wider. In addition, the bonding structures have smoother join profile and planar joint plane. As a result, the bonding structures are less likely to crack and also are less likely to crack. Both the yield and the form factor of the package on package structure are improved. |
申请公布号 |
US8704354(B2) |
申请公布日期 |
2014.04.22 |
申请号 |
US201213586629 |
申请日期 |
2012.08.15 |
申请人 |
CHENG JUNG WEI;WANG TSUNG-DING;LEE CHIEN-HSUN;CHUANG CHUN-CHIH;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHENG JUNG WEI;WANG TSUNG-DING;LEE CHIEN-HSUN;CHUANG CHUN-CHIH |
分类号 |
H01L23/02;H01L21/00 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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