| 摘要 |
The present invention relates to a carrier unit for a chemical mechanical polishing system for rotating and pressurizing a mounted substrate which is to be polished downward. The carrier unit for a chemical mechanical polishing system comprises a rotary union disposed at the center of the carrier unit and pressurizing the substrate downward by the supply of fluid; a rotational axis which is mounted by penetrating the inside of the rotary union; a pneumatic motor mounted at the upper part of the rotary union and delivering power to the rotational axis; an air docking part mounted at the carrier unit surface for supplying air to the rotary union and pneumatic motor; and a carrier head, where the substrate is mounted and which is connected to the rotational axis. The power of the pneumatic motor is delivered to the vertical direction of the carrier unit in a serial direction. [Reference numerals] (114) Pressure control part; (116) Rotation detection part |
