发明名称 |
Thermal management of stacked semiconductor chips with electrically non-functional interconnects |
摘要 |
A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip. |
申请公布号 |
US8704353(B2) |
申请公布日期 |
2014.04.22 |
申请号 |
US201213436066 |
申请日期 |
2012.03.30 |
申请人 |
SU MICHAEL;BLACK BRYAN;MCLELLAN NEIL;SIEGEL JOE;ALFANO MICHAEL;ADVANCED MICRO DEVICES, INC. |
发明人 |
SU MICHAEL;BLACK BRYAN;MCLELLAN NEIL;SIEGEL JOE;ALFANO MICHAEL |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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