发明名称 Capacitive microphone with integrated cavity
摘要 A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.
申请公布号 US8705775(B2) 申请公布日期 2014.04.22
申请号 US20090597572 申请日期 2009.12.01
申请人 SHEPLAK MARK;ARNOLD DAVID PATRICK;UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC. 发明人 SHEPLAK MARK;ARNOLD DAVID PATRICK
分类号 H04R25/00 主分类号 H04R25/00
代理机构 代理人
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