发明名称 Semiconductor device and method for manufacturing the same
摘要 According to one embodiment, a semiconductor device includes a first insulating layer provided in a first area and in a second area, a line-and-space-like second insulating layer formed on the first insulating layer provided in the first area, and a third insulating layer formed on the first insulating layer provided in the second area and which is substantially identical to the second insulating layer in height.
申请公布号 US8704374(B2) 申请公布日期 2014.04.22
申请号 US201213428569 申请日期 2012.03.23
申请人 HAYASHI YUMI;KABUSHIKI KAISHA TOSHIBA 发明人 HAYASHI YUMI
分类号 H01L23/48;H01L23/52 主分类号 H01L23/48
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