METHOD FOR MANUFACTURING PCB FORMING CIRCUIT PATTERN AND CONNECTING THE CIRCUIT PATTERN THROUGH VIA-HOLE BY PRINTING METHOD

摘要

The present invention relates to a double-sided printed circuit board forming method which is formed by painting a circuit pattern and a conductive line in a via-hole. The double-sided printed circuit board forming method includes: a step for forming a via-hole which penetrates the upper and lower sides of an insulating layer; a first circuit pattern forming step for forming a first circuit pattern with a conductive material on one side of the insulating layer and forming a pattern so that a part of the conductive material is combined with the inner circumferential surface of the via-hole; and a second circuit pattern forming step for forming a second circuit pattern with a conductive material on the other side of the insulating layer which is the opposite side of the one side and forming a pattern so that a part of the conductive material is connected to the first circuit pattern by being combined with the inner circumferential surface of the via-hole. [Reference numerals] (AA) Via-hole processing process; (BB) First circuit pattern printing process; (CC,EE) Heating process; (DD) Second circuit pattern printing process