发明名称 |
Multiple die packaging interposer structure and method |
摘要 |
System and method for providing a multiple die interposer structure. An embodiment comprises a plurality of interposer studs in a molded interposer, with a redirection layer on each side of the interposer. Additionally, the interposer studs may be initially attached to a conductive mounting plate by soldering or wirebond welding prior to molding the interposer, with the mounting plate etched to form one of the redirection layers. Integrated circuit dies may be attached to the redirection layers on each side of the interposer, and interlevel connection structures used to mount and electrically connect a top package having a third integrated circuit to the interposer assembly. |
申请公布号 |
US8703539(B2) |
申请公布日期 |
2014.04.22 |
申请号 |
US201213539182 |
申请日期 |
2012.06.29 |
申请人 |
YU CHEN-HUA;LII MIRNG-JI;TSAI HAO-YI;HUNG JUI-PIN;LEE CHIEN-HSIUN;WU KAI-CHIANG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YU CHEN-HUA;LII MIRNG-JI;TSAI HAO-YI;HUNG JUI-PIN;LEE CHIEN-HSIUN;WU KAI-CHIANG |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|