软硬复合电路板之制造方法,申请号TW100145349-传众专利搜索

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发明名称	软硬复合电路板之制造方法
摘要
申请公布号	TWI435677	申请公布日期	2014.04.21
申请号	TW100145349	申请日期	2011.12.08
申请人	马纯惠新北市莺歌区中湖街307巷9号	发明人	马纯惠
分类号	H05K3/46;B32B37/12	主分类号	H05K3/46
代理机构		代理人
主权项
地址	新北市莺歌区中湖街307巷9号

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