| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element mounting package capable of enhancing the yield by suppressing adhesion of resin powder, capable of forming a fine and adhesive outer layer circuit having a surface flat for an insulating layer, by forming an embedded circuit not causing undercut, capable of forming various metal configurations such as bumps and metal posts by a three-dimensional circuit, and capable of forming a solder resist, and to provide a manufacturing method therefor.SOLUTION: A semiconductor element mounting package comprises: an insulating circuit; a circuit embedded in the surface of the insulating circuit; and a metal post arranged on the embedded circuit. The metal post has the embedded circuit, electroless plating and electroplating, in this order. A manufacturing method therefor is also provided. |
