| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having higher reliability.SOLUTION: A semiconductor device includes: a semiconductor element 2 having a plurality of electrodes 2b on a primary surface 2a; a sealing resin 4 provided so as to cover at least a part of a side surface 2c of the semiconductor element 2; a first insulating layer 3 formed on the primary surface 2a of the semiconductor element 2, on the part of the side surface 2c of the semiconductor element 2, and on the sealing resin 4, having a first opening H1 to expose the plurality of electrodes 2b on the primary surface 2a, and having a fillet portion 3a on the part of the side surface 2c; a wiring layer 5 provided in the first opening H1 and on the first insulating layer 3 so as to be electrically connected to the plurality of electrodes 2b; and a second insulating layer 6 having a second opening H2 to surround a predetermined region of the wiring layer 5 and formed on the first insulating layer 3 and the wiring layer 5. |
