发明名称 SOLDER ALLOY FOR JOINING ALUMINUM
摘要 PROBLEM TO BE SOLVED: To provide a solder alloy for joining Sn-Zn aluminum, which improves solderability by suppressing oxidation of the solder alloy.SOLUTION: In a solder alloy for joining aluminum, 10.0-30.0 wt.% of Zn and 0.1-3.0 wt.% of Al are added to Sn. Ag, Sb, Ni, Co, Fe, Cr and the like can also be added as strength improving elements, Bi, In and the like can also be added as melting point lowering elements, or P, Ga, Ge and the like can also be added as antioxidation elements.
申请公布号 JP2014069218(A) 申请公布日期 2014.04.21
申请号 JP20120217837 申请日期 2012.09.28
申请人 NIHON ALMIT CO LTD 发明人 SAWAMURA SADA;KADOTA TAKASHI;IGARASHI GAKUO;MAEDA YUKIO;KANEKO KAZUHIKO
分类号 B23K35/26;B23K1/19;B23K103/10;C22C13/00;H05K3/34 主分类号 B23K35/26
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