| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing method capable of flatly grinding a wafer in which a swollen part is formed in an outer peripheral edge thereof.SOLUTION: A wafer processing method comprises the steps of: sticking a surface protecting member, which covers a device region of a wafer and has a diameter with a length which does not reach a swollen part and a thickness thicker than the height of the swollen part, to the device region of the wafer and exposing the swollen part; holding wafer on a holding table via the surface protecting member and exposing a rear surface of the wafer (holding step); and thinning the wafer to a prescribed thickness by grinding the rear surface of the wafer by grinding means after performing the holding step (thinning step). |
