发明名称 SEAL STRUCTURE OF THROUGH HOLE, WIRING BODY FOR USE THEREIN, MANUFACTURING METHOD FOR WIRING BODY AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a seal structure or the like of a through hole which can ensure a required waterproof performance easily.SOLUTION: A seal structure of a through hole provided in a housing of an electronic apparatus and through which a wiring member is inserted includes: a lid member covering the through hole; a frame member provided between the lid member and the housing and holding the wiring member between the lid member and itself while surrounding the through hole; a first adhesive layer provided between the lid member and the frame member and bonding these members while sealing around the wiring member; and a second adhesive layer provided between the frame member and the housing and bonding these members while surrounding the through hole. The first adhesive layer includes an extension extending inward from the inner edge of the frame member.
申请公布号 JP2014072281(A) 申请公布日期 2014.04.21
申请号 JP20120215722 申请日期 2012.09.28
申请人 SUMITOMO ELECTRIC PRINTED CIRCUIT INC 发明人 UNEKI YU
分类号 H05K7/00 主分类号 H05K7/00
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