| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated multi-chip memory module capable of high speed operation without reducing yield even if wafers are laminated with each other and without increase in a mounting area in a multi-chip memory module formed by laminating a plurality of memory chips having a through-silicon via.SOLUTION: A multi-chip memory module is characterized in that a redundant memory chip having a redundant memory cell provided therein is included in a plurality of memory chips, a memory circuit storing information on a defective place is assembled in the other memory chip, a function in which an access destination is switched to the redundant memory chip is provided when the defective place is accessed, and normal operation is maintained by the redundant memory cell corresponding to the defective place. |
