发明名称 SOLID STATE IMAGE PICKUP DEVICE AND MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve shading characteristics more definitely.SOLUTION: A solid state image pickup device including a semiconductor substrate on which a plurality of pixels are formed, an upper layer film laminated on the semiconductor substrate and on-chip lenses formed on the upper layer film corresponding to respective pixels, in which a pupil correction amount of the on-chip lens is varied depending on a distance from the center of a pixel region to the on-chip lens and a film thickness of the upper layer film at a position of the on-chip lens on the upper layer. The present art can be applied to a CMOS image sensor, for example.
申请公布号 JP2014072471(A) 申请公布日期 2014.04.21
申请号 JP20120219035 申请日期 2012.10.01
申请人 SONY CORP 发明人 NISHIFUJI HIROMASA
分类号 H01L27/14;H04N5/369;H04N5/374 主分类号 H01L27/14
代理机构 代理人
主权项
地址