SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND ADHESIVE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which enables a semiconductor device to be simply manufactured when the semiconductor device is manufactured by mounting a work on wiring formed on a base and subsequently separating the work with the wiring from the base.SOLUTION: A manufacturing method of a semiconductor device having a structure in which a work is mounted on wiring comprises: a process of preparing an adhesive sheet in which a first adhesive layer and a second layer having an adhesive force after being attached to a base, which is lower than that of the first adhesive layer are layered; a process of laminating the adhesive sheet on the base; a process of forming wiring on the adhesive sheet after being attached to the base; a process of mounting a work on the wiring; and a process of separating from the base, the work with the wiring after being mounted.