SYSTEM AND METHOD OF NOVEL MX TO MX-2

摘要

PROBLEM TO BE SOLVED: To provide improved techniques for metal interconnection within an integrated circuit die.SOLUTION: A plurality of metal tracks are formed in three metal layers stacked in an integrated circuit die. A protective dielectric layer is formed around the metal tracks of an intermediate metal layer. The protective dielectric layer acts as a hard mask to define contact vias between the metal tracks in the metal layers above and below the intermediate metal layer.