| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device which performs polishing by bringing plate-like work held on a holding surface of a holding table into contact with a polishing pad, and maintains the holding surface of the holding table parallel to a pad mounting surface with high precision.SOLUTION: A polishing device 1 includes at least: a holding table 2 having a holding surface 200 for holding plate-like work; polishing means 3 having a pad mounting surface 320 on which a rotatable polishing pad 33 for polishing the plate-like work is mounted; adjusting means 5 which adjusts parallelism of a polishing surface 330 of the polishing pad 33 to the holding surface 200; and polishing feed means 4 which makes the polishing means 3 approach and separate from the holding table 2. A sheet-like pressure detection sheet 7 with a plurality of pressure detection parts arrayed is mounted on the holding surface 200, and the polishing pad 33 is pressed to the pressure detection sheet 7 to recognize pressure distribution of the pressure detection sheet 7. On the basis of the pressure distribution, the parallelism of the holding surface 200 of the holding table 2 and the pad mounting surface 320 is controlled by the adjusting means 5. |
